Supermicro SYS-822GS-NB3RT — NVIDIA HGX B300 NVL8 8-GPU AI Server (Configuration B, InfiniBand Cluster) — ขอใบเสนอราคา

Supermicro SYS-822GS-NB3RT — NVIDIA HGX B300 NVL8 8-GPU AI Server (Configuration B, InfiniBand Cluster) — ขอใบเสนอราคา

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สอบถามสินค้า จัดสเป็ค แอดไลน์ @gearlab

ขอใบเสนอราคา (Request Quote) — ทักไลน์ @gearlab หรือ https://m.me/gearlabth

Supermicro SYS-822GS-NB3RT 8U ระบบ AI Server ระดับ Enterprise บน NVIDIA HGX B300 NVL8 8-GPU Platform รุ่น Full InfiniBand Fabric เหมาะสำหรับการขยายระบบเป็น Multi-Node Cluster ขนาดใหญ่

Form Factor 8U Rackmount
GPU NVIDIA HGX B300 NVL8, 8x B300 GPU, Air-Cooled (288GB HBM3e รวม)
CPU 2x Intel Xeon 6768P
RAM 32x 96GB DDR5-6400 ECC RDIMM (3TB รวม)
Storage 2x 960GB M.2 NVMe PCIe 4.0 SSD, 2x 7.68TB E1.S NVMe PCIe Gen5 SSD
Networking (Compute Fabric) 8x NVIDIA ConnectX-8 SuperNIC 800G OSFP InfiniBand (หนึ่งต่อ GPU) — รองรับ Multi-Node Scale-Out
Networking (Management) 1x NVIDIA ConnectX-6 Lx Dual-Port 25GbE SFP28, 4x 25GbE SFP28 Optical Transceivers
Power 6x 6600W Titanium Redundant PSU (3+3)
Security / Management TPM 2.0, Tool-less Rail Kit, SDDC Remote Management License
NIC Reference MELLANOX-MCX755106AS-HEAT

การใช้งานที่เหมาะสม: Distributed Multi-Node AI Training Cluster, Large-Scale LLM Training, Generative AI ระดับ Data Center, HPC ขนาดใหญ่

 

Key Applications

  • Scientific Research
  • Conversational AI
  • Business Intelligence & Analytics
  • Drug Discovery
  • Finance Services and Fraud Detection
  • AI/Deep Learning Training and Inference
  • Large Language Model (LLM) and Generative AI
  • High Performance Computing (HPC)
  • Autonomous Vehicle Technologies

Key Features

 

  1. Dual Intel® Xeon® 6700 series processors with P-cores, up to 350W TDP
  2. NVIDIA HGX B300 8-GPU with 5th Generation NVLink® 1.8TB/s, 2.3TB of HBM3e GPU memory per system
  3. 8x NVIDIA ConnectX®-8 SuperNICs, up to 800Gb/s, up to two North/South NICs
  4. 8x Hot-swap E1.S NVMe storage drive bays and 2x M.2 NVMe boot drives
  5. 32x DIMMs with up to 8TB at 5200MT/s or up to 4TB at 6400MT/s DDR5 RDIMM
  6. 6x redundant (3+3) 6.6kW Titanium level power supplies

 

Product SKUs
SYS-822GS-NB3RT
SYS-822GS-NB3RT-01-G2 Gold Series version with pre-configured components
SYS-822GS-NB3RT-02-G2 Gold Series version with pre-configured components
Motherboard
Super X14DBG-LC
Processor
CPU
Core Count
  • Up to 86C/172T; Up to 336MB Cache per CPU
Note
  • Supports up to 350W TDP CPUs (Air Cooled)
GPU
Max GPU Count
  • 8 onboard GPUs
Supported GPU
GPU-GPU Interconnect
  • NVIDIA® NVLink™ with NVSwitch™
System Memory
Memory
  • Slot Count: 32 DIMM slots
  • Max Memory (1DPC): Up to 4TB 6400MT/s ECC DDR5 RDIMM
  • Max Memory (2DPC): Up to 8TB 6000MT/s ECC DDR5 RDIMM
  • View Memory Options
Memory Voltage
  • 1.1V
On-Board Devices
Network Connectivity
Input / Output
LAN
  • 2 RJ45 10 GbE LAN ports (Intel® X710)
  • 8 OSFP 800 GbE LAN ports (NVIDIA ConnectX®-8 SuperNIC™)
USB
  • 1 USB 3.0 Type-A port (Front)
  • 1 USB 2.0 Type-A port (Front)
Video
  • 1 VGA port
  • 1 mini-DP port
System BIOS
BIOS Type
  • AMI 64MB UEFI
Management
Software
Power configurations
  • Power-on mode for AC power recovery
  • ACPI Power Management
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU
  • 8+4 Phase-switching voltage regulator
  • Monitors for CPU Cores, Chipset Voltages, Memory
Fan
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Certifications
Operating Systems
Chassis
Form Factor
  • 8U Rackmount
Model
  • CSE-GP807TS-R000NP
Dimensions and Weight
Height
  • 13.8" (356 mm)
Width
  • 17.6" (449 mm)
Depth
  • 37.4" (950 mm)
Package
  • 26.38" (H) x 28.74" (W) x 50.39" (D)
Weight
  • Gross Weight: 302 lbs (137 kg)
  • Net Weight: 263 lbs (119 kg)
Available Color
  • Silver
Front Panel
Buttons
  • Power On/Off
  • UID
LED
  • HDD activity
  • LAN1 activity
  • LAN2 activity
  • Power Fail
  • Power status
  • System information (overheat/UID)
Expansion Slots
PCI-Express (PCIe) Configuration
Drive Bays / Storage
Drive Bays Configuration
M.2
System Cooling
Fans
  • Up to 12 heavy duty fans with optimal fan speed control
Power Supply
6x 6600W Redundant (3 + 3) Titanium Level (96%) power supplies
Dimension (WxHxL) 106.5 x 82.1 x 245.3 mm
Input 5900W: 200-207.9Vac / 50-60Hz
6000W: 208-219.9Vac / 50-60Hz
6300W: 220-229.9Vac / 50-60Hz
6500W: 230-238.9Vac / 50-60Hz
6600W: 239-240Vac / 50-60Hz
+12V Max: 130A / Min: 0A (200Vac-207.9Vac)
Max: 130A / Min: 0A (208Vac-219.9Vac)
Max: 130A / Min: 0A (220Vac-229.9Vac)
Max: 130A / Min: 0A (230Vac-238.9Vac)
Max: 130A / Min: 0A (239Vac-240Vac)
12V SB Max: 4A / Min: 0A
Output Type Backplanes (gold finger)
Certification Titanium Level94%+  Titanium Level

[ Test Report ]
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)

 

ขอใบเสนอราคา (Request Quote) — ทักไลน์ @gearlab หรือ https://m.me/gearlabth

Supermicro SYS-822GS-NB3RT 8U ระบบ AI Server ระดับ Enterprise บน NVIDIA HGX B300 NVL8 8-GPU Platform รุ่น Full InfiniBand Fabric เหมาะสำหรับการขยายระบบเป็น Multi-Node Cluster ขนาดใหญ่

Form Factor 8U Rackmount
GPU NVIDIA HGX B300 NVL8, 8x B300 GPU, Air-Cooled (288GB HBM3e รวม)
CPU 2x Intel Xeon 6768P
RAM 32x 96GB DDR5-6400 ECC RDIMM (3TB รวม)
Storage 2x 960GB M.2 NVMe PCIe 4.0 SSD, 2x 7.68TB E1.S NVMe PCIe Gen5 SSD
Networking (Compute Fabric) 8x NVIDIA ConnectX-8 SuperNIC 800G OSFP InfiniBand (หนึ่งต่อ GPU) — รองรับ Multi-Node Scale-Out
Networking (Management) 1x NVIDIA ConnectX-6 Lx Dual-Port 25GbE SFP28, 4x 25GbE SFP28 Optical Transceivers
Power 6x 6600W Titanium Redundant PSU (3+3)
Security / Management TPM 2.0, Tool-less Rail Kit, SDDC Remote Management License
NIC Reference MELLANOX-MCX755106AS-HEAT

การใช้งานที่เหมาะสม: Distributed Multi-Node AI Training Cluster, Large-Scale LLM Training, Generative AI ระดับ Data Center, HPC ขนาดใหญ่

 

Key Applications

  • Scientific Research
  • Conversational AI
  • Business Intelligence & Analytics
  • Drug Discovery
  • Finance Services and Fraud Detection
  • AI/Deep Learning Training and Inference
  • Large Language Model (LLM) and Generative AI
  • High Performance Computing (HPC)
  • Autonomous Vehicle Technologies

Key Features

 

  1. Dual Intel® Xeon® 6700 series processors with P-cores, up to 350W TDP
  2. NVIDIA HGX B300 8-GPU with 5th Generation NVLink® 1.8TB/s, 2.3TB of HBM3e GPU memory per system
  3. 8x NVIDIA ConnectX®-8 SuperNICs, up to 800Gb/s, up to two North/South NICs
  4. 8x Hot-swap E1.S NVMe storage drive bays and 2x M.2 NVMe boot drives
  5. 32x DIMMs with up to 8TB at 5200MT/s or up to 4TB at 6400MT/s DDR5 RDIMM
  6. 6x redundant (3+3) 6.6kW Titanium level power supplies

 

Product SKUs
SYS-822GS-NB3RT
SYS-822GS-NB3RT-01-G2 Gold Series version with pre-configured components
SYS-822GS-NB3RT-02-G2 Gold Series version with pre-configured components
Motherboard
Super X14DBG-LC
Processor
CPU
Core Count
  • Up to 86C/172T; Up to 336MB Cache per CPU
Note
  • Supports up to 350W TDP CPUs (Air Cooled)
GPU
Max GPU Count
  • 8 onboard GPUs
Supported GPU
GPU-GPU Interconnect
  • NVIDIA® NVLink™ with NVSwitch™
System Memory
Memory
  • Slot Count: 32 DIMM slots
  • Max Memory (1DPC): Up to 4TB 6400MT/s ECC DDR5 RDIMM
  • Max Memory (2DPC): Up to 8TB 6000MT/s ECC DDR5 RDIMM
  • View Memory Options
Memory Voltage
  • 1.1V
On-Board Devices
Network Connectivity
Input / Output
LAN
  • 2 RJ45 10 GbE LAN ports (Intel® X710)
  • 8 OSFP 800 GbE LAN ports (NVIDIA ConnectX®-8 SuperNIC™)
USB
  • 1 USB 3.0 Type-A port (Front)
  • 1 USB 2.0 Type-A port (Front)
Video
  • 1 VGA port
  • 1 mini-DP port
System BIOS
BIOS Type
  • AMI 64MB UEFI
Management
Software
Power configurations
  • Power-on mode for AC power recovery
  • ACPI Power Management
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU
  • 8+4 Phase-switching voltage regulator
  • Monitors for CPU Cores, Chipset Voltages, Memory
Fan
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Certifications
Operating Systems
Chassis
Form Factor
  • 8U Rackmount
Model
  • CSE-GP807TS-R000NP
Dimensions and Weight
Height
  • 13.8" (356 mm)
Width
  • 17.6" (449 mm)
Depth
  • 37.4" (950 mm)
Package
  • 26.38" (H) x 28.74" (W) x 50.39" (D)
Weight
  • Gross Weight: 302 lbs (137 kg)
  • Net Weight: 263 lbs (119 kg)
Available Color
  • Silver
Front Panel
Buttons
  • Power On/Off
  • UID
LED
  • HDD activity
  • LAN1 activity
  • LAN2 activity
  • Power Fail
  • Power status
  • System information (overheat/UID)
Expansion Slots
PCI-Express (PCIe) Configuration
Drive Bays / Storage
Drive Bays Configuration
M.2
System Cooling
Fans
  • Up to 12 heavy duty fans with optimal fan speed control
Power Supply
6x 6600W Redundant (3 + 3) Titanium Level (96%) power supplies
Dimension (WxHxL) 106.5 x 82.1 x 245.3 mm
Input 5900W: 200-207.9Vac / 50-60Hz
6000W: 208-219.9Vac / 50-60Hz
6300W: 220-229.9Vac / 50-60Hz
6500W: 230-238.9Vac / 50-60Hz
6600W: 239-240Vac / 50-60Hz
+12V Max: 130A / Min: 0A (200Vac-207.9Vac)
Max: 130A / Min: 0A (208Vac-219.9Vac)
Max: 130A / Min: 0A (220Vac-229.9Vac)
Max: 130A / Min: 0A (230Vac-238.9Vac)
Max: 130A / Min: 0A (239Vac-240Vac)
12V SB Max: 4A / Min: 0A
Output Type Backplanes (gold finger)
Certification Titanium Level94%+  Titanium Level

[ Test Report ]
Operating Environment
Environmental Spec.
  • Operating Temperature: 10°C to 35°C (50°F to 95°F)
  • Non-operating Temperature: -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity: 8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 5% to 95% (non-condensing)

 

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